发明名称 Fin diode structure
摘要 A fin diode structure and method of manufacturing the same is provided in present invention, which the structure includes a substrate, a doped well formed in the substrate, a plurality of fins of first conductivity type and a plurality of fins of second conductivity type protruding from the doped well, and a doped region of first conductivity type formed globally in the substrate between the fins of first conductivity type, the fins of second conductivity type, the shallow trench isolation and the doped well and connecting with the fins of first doped type and the fins of second doped type.
申请公布号 US9093565(B2) 申请公布日期 2015.07.28
申请号 US201313941555 申请日期 2013.07.15
申请人 UNITED MICROELECTRONICS CORP. 发明人 Wang Chang-Tzu;Chang Ping-Chen;Tang Tien-Hao;Su Kuan-Cheng
分类号 H01L21/70;H01L29/861;H01L21/76;H01L27/02 主分类号 H01L21/70
代理机构 代理人 Hsu Winston;Margo Scott
主权项 1. A fin diode structure, comprising: a substrate; a doped well formed in said substrate; a plurality of fins of first conductivity type and a plurality of fins of second conductivity type protruding from said doped well, wherein said fins of first conductivity type and said fins of second conductivity type are isolated from each other by shallow trench isolations, and a doped region of first conductivity type formed globally in said substrate between said fins of first conductivity type, said fins of second conductivity type, said shallow trench isolations and said doped well and connecting with said fins of first conductivity type and said fins of second conductivity type; and the doping concentration of said fin of first conductivity type is higher than the doping concentration of said doped region of first conductivity type, and the doping concentration of said doped region of first conductivity type is higher than the doping concentration of said doped well of first conductivity type.
地址 Science-Based Industrial Park, Hsin-Chu TW