发明名称 Nonvolatile semiconductor memory device and method of manufacturing the same
摘要 According to one embodiment, a nonvolatile semiconductor memory device includes a magnetoresistive element formed on a semiconductor substrate, a first contact plug which extends through an interlayer dielectric film formed on the semiconductor substrate and immediately below the magnetoresistive element, has a bottom surface in contact with an upper surface of the semiconductor substrate, and is adjacent to the magnetoresistive element, and an insulating film formed between the magnetoresistive element and the first contact plug and on the interlayer dielectric film, wherein the insulating film includes a first region positioned on a side of the interlayer dielectric film, and a second region positioned in the insulating film and on an upper surface of the first region, the insulating film is made of SiN, and the first region is a nitrogen rich film compared to the second region.
申请公布号 US9093632(B2) 申请公布日期 2015.07.28
申请号 US201414203422 申请日期 2014.03.10
申请人 发明人 Tsubata Shuichi;Yoshikawa Masatoshi;Seto Satoshi;Tomioka Kazuhiro;Ha Ga Young
分类号 H01L27/00;H01L43/02;H01L43/12;H01L27/22;H01L21/28 主分类号 H01L27/00
代理机构 Holtz, Holtz, Goodman & Chick PC 代理人 Holtz, Holtz, Goodman & Chick PC
主权项 1. A nonvolatile semiconductor memory device comprising: a magnetoresistive element formed on a semiconductor substrate; a first contact plug which extends through an interlayer dielectric film formed on the semiconductor substrate and immediately below the magnetoresistive element, has a bottom surface in contact with an upper surface of the semiconductor substrate, and is adjacent to the magnetoresistive element; and an insulating film formed between the magnetoresistive element and the first contact plug and on the interlayer dielectric film, wherein the insulating film includes a first region positioned on a side of the interlayer dielectric film, and a second region positioned in the insulating film and on an upper surface of the first region, the insulating film is made of SiN, and the first region is a nitrogen-rich film compared to the second region.
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