SPUTTERING APPARATUS AND METHOD FOR FORMING THIN FILM USING THE SAME

摘要

The present invention relates to a sputtering apparatus and a method for forming a thin film using the same. The sputtering apparatus comprises: a substrate holder unit composed of a chamber which has a thin film forming space, and a deposited material mounting unit which is positioned in the thin film forming space of the chamber; sputter guns which are positioned in the third quarter surface and a fourth quarter surface in the lower side about a horizontal central axis of the deposited material mounting unit, in order to release up a target material toward the horizontal central side of the deposited material mounting unit from the lower part; at least one ion gun which is installed in the chamber in the upper part of the horizontal central axis in order to irradiate down ion beams toward the center of the deposited material mounting unit; and a vacuum purge unit which is to vacuumize the thin film forming space in the chamber. Therefore, the sputtering apparatus can form both a single thin film and a complex thin film and can form a consistent thin film.