发明名称 Three-dimensional memory comprising discrete read/write-voltage generator die
摘要 The present invention discloses a discrete three-dimensional memory (3D-M). Its 3D-M arrays are located on at least one 3D-array die, while its read/write-voltage generator (VR/VW-generator) is located on a separate peripheral-circuit die. The VR/VW-generator generates at least a read and/or write voltage to the 3D-array die. A single VR/VW-generator die can support multiple 3D-array dies.
申请公布号 US9093153(B2) 申请公布日期 2015.07.28
申请号 US201414487080 申请日期 2014.09.15
申请人 HangZhou HaiCun Information Technology Co. Ltd. 发明人 Zhang Guobiao
分类号 G11C16/04;G11C13/00;G11C5/02;G11C5/14;G11C8/14;G11C16/10;H01L27/115;G11C16/30;H01L25/065;H01L25/10 主分类号 G11C16/04
代理机构 代理人
主权项 1. A discrete three-dimensional memory (3D-M), comprising: a 3D-array die comprising at least a 3D-M array including a plurality of vertically stacked memory cells; a peripheral-circuit die comprising at least a portion of a read/write-voltage generator for providing said 3D-array die with at least a read voltage and/or a write voltage other than the voltage supply, wherein said portion of said read/write-voltage generator is absent from said 3D-array die; wherein said peripheral-circuit die comprises fewer back-end layers than said 3D-array die; and, said 3D-array die and said peripheral-circuit die are separate dice.
地址 HangZhou, ZheJiang CN