Multi-chip packaged integrated circuit with flash memory and slave memory controller

摘要

A multi-chip packaged integrated circuit part for mounting to a printed circuit board of a memory module. The multi-chip packaged integrated circuit part comprises an integrated circuit package including a slave memory controller (SMC) die; and pairs of a spacer under the slave memory controller die, and a flash memory die under the spacer. In each pair, the flash memory die may be larger than the spacer so that an opening is provided into a perimeter of the flash memory die to allow electrical connections to be made. A plurality of conductors may be used to electrically couple the slave memory controller die and the flash memory die to one or more pads of a pin-out of the integrated circuit package.

主权项

1. A multi-chip packaged integrated circuit part to mount to a printed circuit board of a memory module, the multi-chip packaged integrated circuit part comprising:
an integrated circuit package including
a slave memory controller (SMC) die;one or more pairs of
a spacer under the slave memory controller die, anda flash memory die under the spacer,wherein the flash memory die is larger than the spacer to provide an opening into a perimeter of the flash memory die to which electrical connections may be made;a first plurality of conductors electrically coupling the slave memory controller die to one or more independent pads of a pin-out of the integrated circuit package;a second plurality of conductors electrically coupling the slave memory controller die to one or more joint pads of the pin-out; anda third plurality of conductors electrically coupling one or more of the flash memory die to the one or more joint pads of the pin-out to electrically couple the flash memory die to the slave memory control die.