| 发明名称 | Ultrasonic transducer and method of manufacturing the same | ||
| 摘要 | An ultrasonic transducer and a method of manufacturing the same are disclosed. The ultrasonic transducer includes a conductive substrate, a projection which is disposed on the conductive substrate and which forms a cavity therein, a via hole which penetrates the projection and conductive substrate, a first electrode which includes a metal and which fills the via hole, a second electrode which is provided on a bottom of the conductive substrate, a membrane which is provided on the projection and which covers the cavity, and an upper electrode which is provided on the membrane and which contacts the first electrode. | ||
| 申请公布号 | US9090458(B2) | 申请公布日期 | 2015.07.28 |
| 申请号 | US201313960874 | 申请日期 | 2013.08.07 |
| 申请人 | SAMSUNG ELECTRONICS CO., LTD. | 发明人 | Hong Seog-woo |
| 分类号 | B81B3/00;B81C1/00;B06B1/02;G01N29/24 | 主分类号 | B81B3/00 |
| 代理机构 | Sughrue Mion, PLLC | 代理人 | Sughrue Mion, PLLC |
| 主权项 | 1. An ultrasonic transducer comprising: a conductive substrate; a projection which is disposed on the conductive substrate and which forms a cavity inside of the conductive substrate; a via hole which penetrates the projection and the conductive substrate; a first electrode which comprises a metal, which first electrode fills the via hole; a second electrode which is provided on a bottom of the conductive substrate; a membrane which is provided on the projection and which covers the cavity; and an upper electrode which is provided on the membrane and which contacts the first electrode. | ||
| 地址 | Suwon-si KR | ||