Integrated circuit packaging system with heat spreader and method of manufacture thereof

摘要

An integrated circuit packaging system, and method of manufacture therefor, includes: a substrate; a mold cap formed on the substrate; fiducial mark inscribed in the mold cap; a thermal interface material applied over the substrate and referenced by the fiducial mark; and a heat spreader, mounted on the thermal interface material, precisely positioned by a position notch aligned relative to the fiducial mark.

主权项

1. A method of manufacture of an integrated circuit packaging system comprising:
providing a substrate; forming a mold cap, on the substrate; inscribing a fiducial mark in the mold cap; positioning a thermal interface material, applied over the substrate, referenced by the fiducial mark; and mounting a heat spreader, on the thermal interface material, precisely positioned by aligning a position notch relative to the fiducial mark, the heat spreader having a bottom surface above a top surface of the mold cap and a portion of thermal interface material exposed from the heat spreader and the mold cap.