| 摘要 |
PROBLEM TO BE SOLVED: To provide electroconductive paste for laser etching processing, which paste can allow high-density electrode circuit wiring of 50/50 μm or smaller L/S, which would not be dealed with the conventional screen printing method, to be produced at a low cost and under a low environmental load and which paste is made suitable for laser etching processing.SOLUTION: The electroconductive paste for laser etching processing contains a binder resin (A) comprising a thermoplastic resin, metal powder (B) and an organic solvent (C) and is used for forming the circuit wiring of a touch panel, which wiring has 50/50 μm or smaller L/S, by laser etching processing. An electric circuit and the touch panel, each of which is formed by using the electroconductive paste, are also provided. |
