PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING THE SAME, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING TOUCH PANEL

摘要

PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition that can be formed into a photosensitive layer having excellent adhesiveness to a substrate having various conductors, and having excellent developability of an exposed part and developer resistance in an unexposed part, even when development by using an alkaline aqueous solution is repeated, and to provide a photosensitive element using the above composition.SOLUTION: The positive photosensitive resin composition comprises the following components of: (A) a modified phenolic resin having an unsaturated hydrocarbon group; (B) a meta-para cresol resin; (C) an ortho-cresol resin; (D) a compound that generates an acid by light; and (E) a silane compound having a polybasic acid skeleton or a polybasic acid anhydride skeleton. The content of the (E) component is less than 10 parts by mass with respect to total 100 parts by the mass of the (A), (B), (C) and (D) components.