POLISHING APPARATUS, AND METHOD FOR POLISHING AND MANUFACTURING GLASS SUBSTRATE

摘要

A polishing apparatus includes a platen including a polishing surface, a carrier capable of retaining a plurality of glass substrates to be polished by the polishing surface, a plurality of motors that change relative positions between the polishing surface and the carrier, and a control part configured to control polishing conditions of the plurality of glass substrates, so that a polishing speed difference at the polishing surface of the platen is reduced.