| 摘要 |
<p>An embodiment of the present invention includes a support part, polishing parts which are selectively arranged on the support part, and a groove which is arranged between the polishing parts, divides the polishing parts and exposes part of the support part. Each of the polishing parts provides a polishing pad for a wafer which is single looped curves with different areas and is surrounded by the groove. Excessive polishing on a wafer edge part using the polishing pad can be prevented. The flatness quality of the wafer can be improved by facilitating the movement of slurry.</p> |
