ANISOTROPIC CONDUCTIVE FILM, CONNECTION STRUCTURE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, AND APPARATUS FOR MANUFACTURING CONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To reduce blocking or the like and to achieve efficient temporary pressure-bonding by suppressing an adhesive component from bleeding in a width direction.SOLUTION: A long anisotropic conductive film 10 is provided, which includes a conductive adhesive layer 11 comprising a binder resin 12 and conductive particles 13 dispersed in the binder resin, and a support body 14 supporting the conductive adhesive layer formed on one surface of the support body. The support body is formed of a stress buffer material having a rubber hardness in a predetermined range. The stress buffer material constituting the support body has a rubber hardness preferably within a range from 50 to 70 degrees.