| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive resin paste composition which is suitably used for adhering a conductor element such as a semiconductor chip and a support member such as a lead frame and has excellent electrical conductivity, thermal conductivity and adhesiveness while reducing the amount used of silver which is rare and expensive material, and to provide a semiconductor device using the resin paste composition.SOLUTION: There is provided a resin paste composition which comprises a (meth)acrylic compound (A), a binder resin (B), an amine compound (C), a polymerization initiator (D), a flexibilizing agent (E), a silver powder (F) and an aluminum powder (G), wherein the silver powder (F) contains a silver powder (F-1) which is coated with stearic acid and has a tap density of 4.0 g/cmor less, the content of the silver powder (F) is 42 mass% or less, the content of the silver powder (F-1) is 11 mass% or more and the mass ratio of the content of the aluminum powder (G) to the content of the silver powder (F) is 0.3 to 2.3. |
