| 摘要 |
<p>According to an embodiment, an apparatus for processing a wafer includes: a first plate which is for placing at least one carrier into which the wafer inserted, and has first holes; a first injection unit which is connected to the first holes; a second plate which faces the first plate and has second holes; a second injection unit which is connected to the second holes; and a first motor and a second motor which drive the first plate and the second plate, respectively.</p> |
