| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a component-built-in substrate which enables the suppression of the warp of the substrate, and enables the achievement of superior component mounting accuracy while suppressing the change (displacement) in component location.SOLUTION: A method for manufacturing a component-built-in substrate comprises the following steps (A), (B), (C) and (D) in this order. In the step (A), a first adhesive film including a first backing and a first thermosetting resin composition layer bonded to the first backing is vacuum-laminated on an insulative substrate with a component temporarily attached therein, which includes an insulative substrate having first and second principal planes, and a cavity extending through between the first and second principal planes, a temporal attachment material bonded to the second principal plane, and the component temporarily attached inside the cavity by the temporal attachment material, provided that the vacuum lamination is performed so that the first thermosetting resin composition layer is bonded to the first principal plane of the insulative substrate. In the step (B), the first thermosetting resin composition layer is thermally processed for suppressing the displacement of the component in the following step (C), provided that the thermal processing is performed within a range which allows the occurrence of substrate warp to be suppressed. In the step (C), after peeling the temporal attachment material from the second principal plane of the insulative substrate, a second adhesive film including a second backing and a second thermosetting resin composition layer bonded to the second backing is vacuum-laminated on the insulative substrate so that the second thermosetting resin composition layer is bonded to the second principal plane of the insulative substrate. In the step (D), the first and second thermosetting resin composition layers are hardened by heat, thereby forming insulative layers.</p> |
