| 摘要 |
<p>A subject of the present invention is providing a plating method of controlling concentration of an additive into a proper range during plating of a substrate. The plating method comprises the steps of: arranging a substrate (W) having a via hole on a surface, and an anode (2) in a plating solution to face each other; charging metal in the via hole by applying voltage between the substrate (W) and the anode (2); measuring the voltage applied to the substrate (W)′calculating change in voltage per a certain time; and adjusting concentration of the additive of the plating solution for change in the voltage to be maintained in a certain management range.</p> |
