| 摘要 |
FIELD: chemistry.SUBSTANCE: invention refers to a polyamide resin composition containing polyamide consisting of a diamine chain containing 70 mole % or more of a paraxylylene diamine chain, and a dicarboxylic acid chain containing 70 mole % or more of aliphatic dicarboxylic acid chain with 6-18 carbon atoms, as well as (B) an aromatic compound of a seconday amine and (C) a sulphur organic compound. The composition contains from 0.05 to 5 weight portions of the sulphur organic compound and from 0.05 to 5 weight portions of the aromatic compound of the secondary amine per 100 weight fractions of polyamide. What is also described is a moulded piece made of the composition.EFFECT: heat resistance, rigidity, high temperature applicability.9 cl, 1 tbl, 13 ex |
