| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a plating apparatus which can form uniform plating film for a processing surface with unevenness of a member targeted for plating.SOLUTION: A plating apparatus comprises: a partition member 10 arranged to face to a surface of a member targetted for plating 2; an electrode 20 arranged in the other side to the member targeted for plating putting the partition member 10 in; a plating solution circulation route 13 provided in the electrode 20 side for the partition member 10; a plating solution supply unit 30 supplying the plating solution to the circulation route 13; a circulation hole 16 which is provided in a position facing a concave part 4 of the member targeted for plating 2 in the partition member 10, and can supply the plating solution to the concave part 4 from the circulation route 13; and a plating solution discharge unit making the plating solution supplied to the concave part 4 side distribute to the surfaces for plating other than the concave part 4 of the member targeted for plating 2, and discharges the plating solution.</p> |
