| 摘要 |
PROBLEM TO BE SOLVED: To provide a CSP light emitting device capable of side-view mounting and wafer level manufacturing; and provide a manufacturing method of the CSP light emitting device.SOLUTION: A light emitting device manufacturing method comprises: a step of preparing a wafer where light emitting elements 1 are arranged on a growth substrate; a step of forming a resin layer 31 having metal wires 32p, 32n connected with a p-side electrode 15 and an n-side electrode 13, respectively, on one surface side of a semiconductor laminate 12; a step of removing a part of or all of the resin layer 31 from a top face side in a thickness direction at each boundary region between the light emitting elements 1 to form grooves 31a thereby to expose end faces 32pa, 32na of the metal wires 32p, 32n as internal wiring on an internal surface of each groove 31a; a step of forming external connection electrodes connected with the exposed end faces 32pa, 32na of the metal wires 32p, 32n; and a step of singulating the wafer into a plurality of individual light emitting elements. |
