| 摘要 |
FIELD: chemistry.SUBSTANCE: invention relates to polymer materials based on organosilicon binder for heat insulation of articles in aircraft building, rocket production, machine building and other industries, which can operate at temperatures of up to 400°C. The heat insulation polymer material includes inorganic filler and a polymer matrix based on an organosilicon block-copolymer of a crosslinking agent and a fire retardant. The heat insulation polymer material contains, as the polymer matrix, a siloxane block-copolymer Lestosil-SM of general formula: HO{[CH5SiO][Si(CH)O]}H, where n=30-60, m=80-130, dissolved in butyl acetate in ratio of 100:70, inorganic filler - glass microspheres, crosslinking agent 119-54 class A, fire retardant - montmorillonite nanosilicate, mixed with butyl acetate in ratio of 0.6:30. ` Inorganic glass microspheres of the class MS-VP-A9 group 2l (TU 6-48-91-92) is used as the filler. The crosslinking agent used is a product 119-54 class A (TU 6-02-1281-84). A method of producing the heat insulation polymer material includes mixing a siloxane block-copolymer with nanofiller, a fire retardant and a crosslinking agent, followed by curing and heat stabilisation. When mixing the components, ultrasonic treatment is carried out at frequency of 40-50 kHz and effective power of 250-360 W.EFFECT: reducing the density of material and smoke emission.3 cl, 2 tbl, 1 ex |
