发明名称 MOLDING METHOD USING POLYAMIDE 9T RESIN SHEET
摘要 PROBLEM TO BE SOLVED: To provide a molding method using a polyamide 9T resin sheet, in which a molded article can be obtained by thermoforming while less likely losing excellent characteristics of a polyamide 9T resin without deforming the polyamide 9T resin sheet.SOLUTION: The polyamide 9T resin sheet 1 is prepared, which has such a portion that the storage modulus (E') thereof is lowered temporarily to 2.0×10Pa or lower within a temperature range from the glass transition point (Tg) of the polyamide 9T resin to (the glass transition point (Tg) thereof +25°C or lower), the relative crystallinity of which is 90% or lower and the thickness of which is 3-500 μm. The molded article is obtained by preliminarily heating the polyamide 9T resin sheet 1 to the temperature range from the glass transition point (Tg) of the polyamide 9T resin to (the glass transition point (Tg) thereof +25°C or lower), and then the heated polyamide 9T resin sheet 1 is thermoformed in a molding metal die 72 the temperature of which is set to another temperature range from the glass transition point (Tg) of the polyamide 9T resin to the temperature lower than the melting point thereof.
申请公布号 JP2015134414(A) 申请公布日期 2015.07.27
申请号 JP20140005622 申请日期 2014.01.16
申请人 SHIN ETSU POLYMER CO LTD 发明人 GONDA TAKASHI;TANAKA KIYOFUMI;SHIMADA TAKENOBU
分类号 B29C51/42 主分类号 B29C51/42
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