发明名称 THERMAL CONDUCTIVE EMI SUPPRESSION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide an interface pad for suppressing electromagnetic and high-frequency radiation.SOLUTION: An interface pad for suppressing electromagnetic and high-frequency radiation includes a first side and a generally-opposed second side that demarcate a thickness therebetween, and has thermal conductivity, electric resistance, and a hardness of Shore 00 hardness 10-70 at 20°C. The interface pad can attenuate electromagnetic and/or high-frequency radiation generally related to interference of electronic components.
申请公布号 JP2015135864(A) 申请公布日期 2015.07.27
申请号 JP20140006063 申请日期 2014.01.16
申请人 BERGQUIST CO 发明人 MISRA SANJAY;JOHN TIMMERMAN;KASYAP SEETHAMRAJU
分类号 H05K9/00;H05K7/20 主分类号 H05K9/00
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