MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a technology that is used to reduce hillocks occurring in a wiring pattern.SOLUTION: A manufacturing method of a semiconductor device includes: a formation step where a wiring pattern made of copper is formed; a heat treatment step where heat treatment is performed to the wiring pattern in an atmosphere of an inactive gas; and a step where plasma treatment is performed to the wiring pattern using a reduction gas after the heat treatment step. A temperature in the plasma treatment is lower than or equal to a temperature in the heat treatment.