JOINING METHOD, DEVICE AND JOINING DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent the occurrence of voids in a laminated substrate with a simple facility.SOLUTION: There is provided a joining method in which a pair of substrates are overlapped and joined to each other. This method includes: a droplet forming stage for attaching liquid on one surface of the pair of substrates to form droplets; a gas exhaustion stage for expanding the droplets along the pair of substrates by holding the droplets between the pair of substrates and pushing the pair of substrates to the droplets while keeping fluidity of the liquid and pushing out gas between the pair of substrates to the outside of the pair of substrates; and a liquid discharge stage for further pushing the pair of substrates while keeping fluidity of the liquid and discharging the liquid from between the pair of substrates.