| 摘要 |
Provided is a semiconductor apparatus comprising: a semiconductor chip; a penetration electrode formed on the semiconductor chip by passing through the semiconductor chip; at least two or more metal units formed on the penetration electrode; a bump part formed by commonly connecting to an upper part of the metal units to apply a data signal inputted from the outside to the metal unit by receiving the data signal; a detecting unit to compare voltage levels of the metal units and to generate a determination signal by individually detecting whether the bump unit is connected to the metal units; and a signal output unit to output the determination signal to the outside. The semiconductor apparatus may improve the reliability of the semiconductor system by detecting whether or not the bump unit is connected to at least two or more metal units. |
