| 摘要 |
PROBLEM TO BE SOLVED: To provide an oscillator and a manufacturing method of the same, which can inhibit the occurrence of solder cracks associated with a temperature change by a simple composition and at low cost, and improve heat cycle resistance.SOLUTION: In an oscillator, an electronic component 2 is lifted up by a land pattern 4 of an electrode formed on a substrate 1 and a solder resist 8c formed to cover a part of the land pattern 4 to form a space between a component electrode 3 and the land pattern 4, and a packaging solder 5 filled in the space and a fillet shape of the packaging solder 5 is formed on lateral faces of the component electrode 3 to increase adhesion of the packaging solder 5. |
