| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a technology capable of reducing formation cost and improving productivity, when forming a coating layer on either main surface of a main conductive layer.SOLUTION: A coating layer is formed by using a sputtering target material formed of a copper alloy in which the content of Ni is 30 wt.% or more and 45 wt.% or less, the content of Zn is 10 wt.% or more and 30 wt.% or less, the total content of Ni and Zn is 55 wt.% or more and 65 wt.% or less, and the residue comprises copper and inevitable impurities.</p> |
