POLYMER GRAFTING FOR ENHANCED DIELECTRIC AND INTERCONNECT MATERIAL ADHESION

摘要

A microelectronic structure may include an interconnect structure, an amine functional reactive polymer layer grafted onto the interconnect structure, and a dielectric layer on the amine functional reactive polymer layer, wherein the dielectric layer is bonded to the polymer layer with an amine bond. In one embodiment, the interconnect structure may be fabricated from a copper containing material. In a further embodiment, the dielectric layer may comprise an oxygen functional reactive dielectric layer, such as an epoxy dielectric layer. In one method of fabricating the microelectronic structure, the amine functional reactive polymer layer may be grafted onto the interconnect structure by an initiated chemical vapor deposition process.

主权项

1. A microelectronic structure, comprising:
an interconnect structure; an amine functional reactive polymer layer grafted onto the interconnect structure; and a dielectric layer on the amine functional reactive polymer layer, wherein the dielectric layer is bonded to the polymer layer with an amine bond.