| 发明名称 |
TEST BOARD WITH LOCAL THERMAL CONDITIONING ELEMENTS |
| 摘要 |
A solution for testing a set of one or more electronic device (105) is disclosed. A corresponding test board (100) comprises a support substrate (205), a set of one of more sockets (210) being mounted on the support substrate each one for housing an electronic device (105) to be tested with a main surface thereof facing the support substrate, for each socket a thermal conditioning element (235) for acting on the main surface of the electronic device, and for each socket biasing means (240) being switchable between an active condition, wherein the biasing means biases the thermal conditioning element in contact with the main surface of the electronic device, and a passive condition, wherein the biasing means maintains the thermal conditioning element separate from the main surface of the electronic device. |
| 申请公布号 |
US2015204942(A1) |
申请公布日期 |
2015.07.23 |
| 申请号 |
US201314411428 |
申请日期 |
2013.06.28 |
| 申请人 |
Eles Semiconductor Equipment S.p.A. |
发明人 |
Scocchetti Fabrizio |
| 分类号 |
G01R31/28;G01R1/04 |
主分类号 |
G01R31/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A test board (100) comprising a support substrate (205), a set of one of more sockets (210) being mounted on the support substrate each one for housing an electronic device (105) to be tested with a main surface thereof facing the support substrate, for each socket a thermal conditioning element (235) for acting on the main surface of the electronic device,
characterized byfor each socket biasing means (240) being switchable between an active condition, wherein the biasing means biases the thermal conditioning element in contact with the main surface of the electronic device, and a passive condition, wherein the biasing means maintains the thermal conditioning element separate from the main surface of the electronic device. |
| 地址 |
Todi IT |
