| 摘要 |
An embodiment of the present invention comprises: a chuck table adsorbing a wafer so as to rotate the adsorbed wafer at a constant speed, when the wafer is loaded; and a spindle spaced apart by a predetermined gap from the top of the chuck table and arranged thereon, and rotating and lowering so as to grind the wafer adsorbed to the chuck table, wherein: the spindle comprises a driving unit for rotating the spindle at a predetermined speed and lowering the spindle by a predetermined distance so as to be in contact with the wafer, and a grinding wheel formed on the lower end of the driving unit to grind a predetermined portion of the thickness of the wafer; the grinding wheel comprises a grinding main body and grinding teeth formed in a segment shape along the circumference of the bottom of the grinding main body; a cooling unit is provided in a predetermined contactless region between a point at which the grinding teeth deviate from the wafer and a point at which the grinding teeth are in contact with the wafer again according to the rotation of the grinding teeth along the rotation path of the grinding teeth; and the cooling unit reduces the temperature of the grinding wheel by spraying cooling water at the rotating grinding teeth. |
