| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board which prevents deterioration of heat dissipation of a heat dissipation structure of heating components mounted on the circuit board, and to provide an electronic device.SOLUTION: A heat transfer member 24 which facilitates heat dissipation of an electronic component 30 is inserted into a through hole 23 formed by a plating through hole 22 so that one surface side end surface 24a exposed on a mounting surface 21a is positioned at the inner layer side relative to one surface side periphery 23a of the through hole 23. |
