| 摘要 |
PROBLEM TO BE SOLVED: To provide chemical milling characterized in that even when a resist pattern is baked after being formed, the resist pattern has excellent adhesiveness to a metal substrate, thereby, permeation of an etching solution to the metal substrate surface is minimized, to have excellent solubility in a resist stripping solution, and the resist is not likely to be folded even when subjected to baking.SOLUTION: Chemical milling is carried out through steps of: forming a photosensitive resin layer from a photosensitive resin composition on a metal substrate; exposing the resist layer to transfer a pattern, curing the exposed part, developing the resist layer with an alkali to remove an unnecessary part (unexposed part) as a resist pattern; baking the resist pattern after the alkali development to form a resist pattern composed only of the cured photosensitive resin layer; and spraying an etching solution to the bare metal substrate other than the resist pattern to etch the metal substrate. The photosensitive resin composition comprises at least (A) an alkali-soluble resin, (B) a photopolymerization initiator, (C) acrylate monomers, and (D) methacrylate monomers, in which with respect to the (C) acrylate monomers, the content of the (D) methacrylate monomers is 0 to 5 mass%, the content of acrylate monomers having 250 or more of double bonds is 70 mass% or more, and the content of acrylate monomers having 150 or less of double bonds is 30 mass% or less. |
