发明名称 Cu-ALLOY WIRING AND Cu-ALLOY SPUTTERING TARGET
摘要 <p>PROBLEM TO BE SOLVED: To provide a Cu-alloy wiring that is used as a protective film of a Cu wiring material, forms an ohmic connection with an ITO film, and has excellent etching property, oxidation resistance, and corrosion resistance.SOLUTION: The Cu-alloy wiring comprises a composition containing at least Ni and Mn, and the balance Cu that may include an inevitable component. When a plane of XY-coordinates is defined by an X axis and a Y axis representing a content of Ni (wt.%) and a content of Mn (wt.%), respectively, the contents of Ni and Mn in the composition are within a range enclosed by the following four points (A), (B), (C), and (D). (A) Ni:20 wt.% and Mn:10 wt.%, (B) Ni:15 wt.% and Mn:20 wt.%, (C) Ni:20 wt.% and Mn:20 wt.%, and (D) Ni:25 wt.% and Mn:15 wt.%. A work function of the Cu-alloy wiring is in a range from 0 eV to -0.2 eV with respect to the work function of ITO.</p>
申请公布号 JP2015131998(A) 申请公布日期 2015.07.23
申请号 JP20140004458 申请日期 2014.01.14
申请人 SUMITOMO METAL MINING CO LTD 发明人 SUDO SHINGO;KITAGAWA NAOAKI
分类号 C22C9/06;C22C9/05;C23C14/14;C23C14/34;H01B1/02;H01B5/02;H01L21/285;H01L21/3205;H01L21/768;H01L23/532 主分类号 C22C9/06
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