| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a surface-treated copper powder that has an excellent sintering delay property, and a production method therefor.SOLUTION: Provided is a surface-treated copper powder in which the N weight% per surface-treated copper powder is 0.02% or more, equations: 50≤x≤1500 and y≥0.2x+600 (x (μg) is an adhesion amount of element selected from Al, Si, Ti, Zr, Ce and Sn, per 1 g of copper powder, and y (°C) is a sintering initiation temperature) are satisfied, and the volume resistivity of a sintered product obtained by calcinating a conductive paste that contains surface-treated copper powder by 50% or more in terms of copper weight, in non-reducing atmosphere at 600 to 900°C, is 10μΩcm or less; and also provided is a method for producing surface-treated copper powder, comprising: a step of obtaining an alkaline-treated copper powder by mixing a copper powder with an alkaline aqueous solution and followed by separation; and a step of obtaining a surface-adhesion reagent-treated copper powder by mixing an alkaline-treated copper powder with a surface-adhesion reagent solution comprising elements selected from Al, Si, Ti, Zr, Ce and Sn, and followed by separation.</p> |
