| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a plating apparatus that can shorten a tact time for substrate processing and improve throughput.SOLUTION: A plating cell 25 includes a bottom plate 37, and side plates 36 and partition walls 50 forming side surfaces of the plating cell 25. The partition walls 50 are higher than the side plates 36. Each side plate 36 forms a first overflow weir that, when a substrate holder 8 holding a substrate W is immersed into a plating solution in a cathode chamber 48, allows the plating solution in the cathode chamber 48 to overflow into an overflow tank 27. An electric field regulation plate 39 forms a second overflow weir that, when the substrate holder 8 holding the substrate W is immersed into the plating solution in the cathode chamber 48, allows the plating solution in the cathode chamber 48 to overflow into an anode chamber 46. The second overflow weir is higher than the first overflow weir by 15-25 mm.</p> |
