| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an adhesive film for coverlay exhibiting excellent peel strength retention rate between a substrate and wiring and a protective film even if exposed to high temperature environment repeatedly, while reducing discoloration of the protective film, and to provide a coverlay, a wiring board, and a method of manufacturing an electronic apparatus.SOLUTION: An adhesive film for coverlay is capable of molten molding, and contains a fluorine-containing copolymer (A) having at least one kind of functional group selected from a group consisting of a carbonyl radical-containing group, a hydroxy group, an epoxy group and an isocyanate group.</p> |
