发明名称 POSITIVE TYPE RESIST COMPOSITION FOR USE IN LIQUID IMMERSION EXPOSURE AND A METHOD OF FORMING THE PATTERN USING THE SAME
摘要 A positive type resist composition for use in liquid immersion exposure comprises: (A) a resin having a monocyclic or polycyclic cycloaliphatic hydrocarbon structure, the resin increasing its solubility in an alkali developer by an action of acid; (B) a compound generating acid upon irradiation with one of an actinic ray and a radiation; (C) an alkali soluble compound having an alkyl group of 5 or more carbon atoms; and (D) a solvent.
申请公布号 US2015205205(A1) 申请公布日期 2015.07.23
申请号 US201414449415 申请日期 2014.08.01
申请人 FUJIFILM Corporation 发明人 KOBAYASHI Hiromi;INABE Haruki
分类号 G03F7/039;G03F7/20 主分类号 G03F7/039
代理机构 代理人
主权项 1. A resist composition for ArF exposure, comprising; (A) a resin having a monocyclic or polycyclic cycloaliphatic hydrocarbon structure, the resin increasing its solubility in an alkali developer by an action of acid; (B) a compound generating acid upon irradiation with one of an actinic ray and a radiation; (C) a resin containing an alkyl group having 2 or more carbon atoms; and (D) a solvent; andwherein the structure of resin (A) and the structure of resin (C) are not in the same compound.
地址 Tokyo JP