发明名称 SURFACE-TREATED COPPER POWDER AND PRODUCTION METHOD THEREFOR
摘要 <p>PROBLEM TO BE SOLVED: To provide a surface-treated copper powder that has an excellent sintering delay property, and a production method therefor.SOLUTION: Provided is a surface-treated copper powder in which x (atomic%), the concentration of element A selected from a group consisting of Al, Si, Ti, Zr, Ce and Sn, determined by multiplex measurement of XPS, per surface-treated copper powder, and y (°C), the sintering initiation temperature, satisfy an equation: 130x+560≤y; and also provided is a method for producing surface-treated copper powder, comprising: a step of obtaining an alkaline-treated copper powder by mixing a copper powder with an alkaline aqueous solution and followed by separation; and a step of obtaining a surface-adhesion reagent-treated copper powder by mixing an alkaline-treated copper powder with a surface-adhesion reagent solution comprising elements selected from Al, Si, Ti, Zr, Ce and Sn, and followed by separation.</p>
申请公布号 JP2015132000(A) 申请公布日期 2015.07.23
申请号 JP20140004465 申请日期 2014.01.14
申请人 JX NIPPON MINING & METALS CORP 发明人 FURUSAWA HIDEKI
分类号 B22F1/00;B22F1/02;H01B1/00;H01B1/22;H01B5/00;H01B13/00 主分类号 B22F1/00
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