| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a processing device capable of preventing a coating sheet covering a sucking and holding member arranged in a holding region not holding a workpiece from coming off when removing individually divided chips without complicating the configuration of a workpiece holding mechanism.SOLUTION: A processing device comprises a workpiece holding mechanism which holds a workpiece, and processing means for processing the workpiece held by the workpiece holding mechanism. The workpiece holding mechanism comprises: a holding table having a plurality of holding regions on the upper surface thereof; a sucking and holding member arranged in each of the plurality of holding regions on the holding table; sucking means for exerting negative pressure on the plurality of holding regions; air supply means for ejecting air to the plurality of holding regions; a coating sheet for covering the sucking and holding member when the workpiece is not held in the sucking and holding member; and magnet means for detachably fixing the coating sheet to the holding table.</p> |
