| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electronic device housing which reduces heat resistance occurring from a heating part to cooling air and thereby efficiently cools boards.SOLUTION: An electronic device housing 1 according to one embodiment is an indirect air cooling type electronic device housing in which multiple boards 2 of an electronic circuit module are stored in a box shaped chassis 4. Communication walls 34, each of which has an air duct 35 formed in a wall, are disposed at positions facing the boards 2, and the communication walls 34 are placed in contact with the boards 2.</p> |
