| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electronic device 10 capable of improving its reliability against vibration.SOLUTION: An electronic device 10 comprises a main substrate 30, first and second sub-substrates 40 and 50, and a reinforcement substrate 60. The main substrate 30 is fixed to a housing 20. The first and second sub-substrates 40 and 50 are bonded to the main substrate 30 in a direction perpendicular to the main substrate 30, with their plate surfaces arranged to face each other. The reinforcement substrate 60 are bonded to each of the first and second sub-substrates 40 and 50 in a state bridging over the first and second sub-substrates 40 and 50. With this structure, the rigidity of both the first and second sub-substrates 40 and 50 against vibration may be enhanced, thereby improving the reliability of the electronic device 10 against vibration.</p> |
