发明名称 WIRING DEVICE AND HOUSING
摘要 <p>PROBLEM TO BE SOLVED: To provide a wiring device and a housing capable of increasing the resistance against the heat generated on a terminal and achieving a reduced thickness.SOLUTION: The wiring device includes: a wiring circuit; and a housing storing the wiring circuit. The wiring circuit has an electric circuit, and terminals for connecting the electric circuit to an external circuit. The housing has a first part for storing the terminals, and a second part for storing the electric circuit. The first part has a heat resistance higher than the second part, and the second part has a mechanical strength higher than the first part.</p>
申请公布号 JP2015133185(A) 申请公布日期 2015.07.23
申请号 JP20140002648 申请日期 2014.01.09
申请人 PANASONIC IP MANAGEMENT CORP 发明人 UJIHARA HIDEAKI;TATSUMI TAKATOSHI
分类号 H01R13/502;H01R13/514;H01R25/00;H02G3/02 主分类号 H01R13/502
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