发明名称 |
WIRING DEVICE AND HOUSING |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring device and a housing capable of increasing the resistance against the heat generated on a terminal and achieving a reduced thickness.SOLUTION: The wiring device includes: a wiring circuit; and a housing storing the wiring circuit. The wiring circuit has an electric circuit, and terminals for connecting the electric circuit to an external circuit. The housing has a first part for storing the terminals, and a second part for storing the electric circuit. The first part has a heat resistance higher than the second part, and the second part has a mechanical strength higher than the first part.</p> |
申请公布号 |
JP2015133185(A) |
申请公布日期 |
2015.07.23 |
申请号 |
JP20140002648 |
申请日期 |
2014.01.09 |
申请人 |
PANASONIC IP MANAGEMENT CORP |
发明人 |
UJIHARA HIDEAKI;TATSUMI TAKATOSHI |
分类号 |
H01R13/502;H01R13/514;H01R25/00;H02G3/02 |
主分类号 |
H01R13/502 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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