| 发明名称 |
SEMICONDUCTOR APPARATUS HAVING PAD AND BUMP |
| 摘要 |
A semiconductor apparatus may include a semiconductor chip, and the semiconductor chip may include a first pad, a second pad, and a bump. The first pad may be configured to receive a signal from an external device, and the second pad may include first and second metal layers electrically isolated from each other. The bump may be stacked over the second pad, and may be configured to receive a signal from a controller chip. |
| 申请公布号 |
US2015206867(A1) |
申请公布日期 |
2015.07.23 |
| 申请号 |
US201414265961 |
申请日期 |
2014.04.30 |
| 申请人 |
SK hynix Inc. |
发明人 |
LIM Soo Bin;LEE Jong Chern |
| 分类号 |
H01L25/18;H01L23/498;H01L23/48;H01L23/00 |
主分类号 |
H01L25/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor apparatus comprising:
a first pad configured to receive a signal external to the semiconductor apparatus; a second pad including first and second metal layers electrically isolated from each other; a controller chip configured to transmit a signal to a bump; and a semiconductor chip stacked over the second pad and including the bump configured to receive a signal from the controller chip. |
| 地址 |
Icheon-si KR |
