| 发明名称 |
LASER FILM DEBONDING METHOD |
| 摘要 |
A laser-based coating removal method debonds a film from a substrate rather than ablating the film. A laser light is transmitted through a transparent film to an underlying bonding layer for bonding the film to one or more additional films and/or a substrate. The laser light is absorbed at the bonding layer and the transparent film is released. In some embodiments, after the transparent film is released it is able to be physically removed. |
| 申请公布号 |
US2015202858(A1) |
申请公布日期 |
2015.07.23 |
| 申请号 |
US201514598031 |
申请日期 |
2015.01.15 |
| 申请人 |
General Lasertronics Corporation |
发明人 |
Simko Richard T. |
| 分类号 |
B32B43/00;B23K26/38 |
主分类号 |
B32B43/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of removing a protective film from a substrate comprising:
a. transmitting a laser light through a transparent film to an underlying bonding layer; and b. absorbing the laser light at the bonding at the layer, wherein as the laser light is absorbed at the bonding layer, the transparent film is released. |
| 地址 |
San Jose CA US |
