COMPOSITION OF A SILVER ALLOY TARGET FOR A SPUTTERING PROCESS
摘要
<p>A composition of a silver alloy target for a sputtering process comprises 0.5-2.0 wt% of palladium (Pd), 0.1-1.5 wt% of platinum (Pt), and the remainder of silver (Ag) and inevitable impurities.</p>
申请公布号
KR20150085236(A)
申请公布日期
2015.07.23
申请号
KR20140004901
申请日期
2014.01.15
申请人
SHINHWA ELECTRON CO., LTD.;DAESUNG METALS CO., LTD.
发明人
LEE, JUNG HYUN;SHIN, WON HO;LEE, SUNG WOO;ROH, YOON KU
