发明名称 LASER SOLDERING HEAD
摘要 PROBLEM TO BE SOLVED: To achieve adjustment of a spot diameter of a laser beam to be projected on a soldering object, without relatively changing a distance between a soldering head and the soldering object, and without affecting imaging of the soldering object with a CCD camera.SOLUTION: An incident light lens 20 movable in an optical axis L1, a semi-transparent mirror 23 inclining by 45 degrees to the optical axis L1 and a condenser lens 22 fixed to a constant position are provided in a prescribed arrangement inside a housing 10, a CCD camera 5 for capturing an image of a soldering object 4 via the semi-transparent mirror 23 and the condenser lens 22 is attached to the inside of the housing 10, and the housing 10 is provided with a position adjustment mechanism 28 for adjusting a position of the incident light lens 20. The position of the incident light lens 20 is adjusted in the optical axis L1 using the position adjustment mechanism 28, so that a diameter of a spot S of the laser beam 3 projected on the soldering object 4 can be adjusted.
申请公布号 JP2015131313(A) 申请公布日期 2015.07.23
申请号 JP20140003624 申请日期 2014.01.10
申请人 JAPAN UNIX CO LTD 发明人 KONO HIROSHI;TANIGUCHI TAKAAKI
分类号 B23K1/005;B23K1/00;B23K26/00;B23K26/064 主分类号 B23K1/005
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