| 发明名称 |
POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, METHOD OF MANUFACTURING POWER MODULE SUBSTRATE, AND COPPER MEMBER-BONDING PASTE |
| 摘要 |
This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate 11; a nitride layer 31 that is formed on the surface of the ceramic substrate 11 between the copper plate and the ceramic substrate 11; and an Ag—Cu eutectic structure layer 32 having a thickness of 15 μm or less that is formed between the nitride layer and the copper plate. |
| 申请公布号 |
US2015208496(A1) |
申请公布日期 |
2015.07.23 |
| 申请号 |
US201314374092 |
申请日期 |
2013.02.01 |
| 申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
Terasaki Nobuyuki;Nagatomo Yoshiyuki;Nishikawa Kimihito;Kuromitsu Yoshirou |
| 分类号 |
H05K1/02;H05K1/09;H05K1/18;B23K35/36;H05K3/38;H05K13/04;B23K35/30;H05K1/03;B23K1/00 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A power module substrate, comprising:
a ceramic substrate and a copper plate that is formed of copper or a copper alloy and is laminated and bonded on a surface of the ceramic substrate; a nitride layer that is formed on the surface of the ceramic substrate between the copper plate and the ceramic substrate; and an Ag—Cu eutectic structure layer having a thickness of 15 μm or less that is formed between the nitride layer and the copper plate. |
| 地址 |
Tokyo JP |
