| 摘要 |
PROBLEM TO BE SOLVED: To provide a fiber containing resin substrate capable of presenting a reliable semiconductor device, having high versatility, suppressing deflection of a substrate and peeling of a semiconductor element from the substrate even in a case where a large-diameter substrate is sealed, and collectively sealing a semiconductor element mounting surface, for excellent heat resistance and moisture resistance after sealing.SOLUTION: A fiber containing resin substrate is used for collectively sealing a semiconductor element mounting surface of a substrate on which a semiconductor element is mounted. The fiber containing resin substrate includes a resin impregnating fiber base material which is obtained by impregnating a fiber base material with thermo-curing resin composition and causing the thermo-curing resin composition to be semi-solidified or totally solidified, and a non-curing resin layer formed of thermo-curing resin composition which has not been cured, formed on one surface of the resin impregnating fiber base material in thickness of more than 200 μm and 2000 μm or less. At least one of the thermo-curing resin composition impregnated into the fiber base material and the thermo-curing resin composition forming the non-cured resin layer is the one containing ion trapping agent. |
