| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a processing method of a wafer capable of preventing debris, adhering to the sidewall of a laser processing groove, from falling off.SOLUTION: A processing method of a wafer has a grooving step for forming a laser processing groove (15) by irradiating a wafer (11) with a laser beam (L) along dividing lines (13), and a cleaning step for fusing debris (17) adhered to one sidewall in the grooving step, by irradiating the laser beam along the laser processing groove while locating a focused spot (L1) between the center of the laser processing groove and one sidewall. The laser beam has an intensity distribution approximate to the Gaussian distribution, the power of the laser beam irradiating the one sidewall in the cleaning step is larger than that of the laser beam irradiating the one sidewall in the grooving step, and is a proper power for the fusion of the debris.</p> |
