发明名称 |
SEMICONDUCTOR DEVICE, DISPLAY DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE |
摘要 |
There is provided a semiconductor device including a first region which, in an oxide semiconductor layer, has a higher carrier concentration than a channel region immediately below a gate electrode formed over the oxide semiconductor layer and is formed at least in a partial region other than the channel region, and a second region which, in the oxide semiconductor layer, has a higher carrier concentration than the first region and is formed farther from the channel region than the first region. The first region is formed through a first reduction reaction by stacking a first reduction reaction film over the oxide semiconductor layer and reducing the oxide semiconductor layer by the first reduction reaction film. The second region is formed through a second reduction reaction by stacking a second reduction reaction film over the oxide semiconductor layer and reducing the oxide semiconductor layer by the second reduction reaction film. |
申请公布号 |
US2015206981(A1) |
申请公布日期 |
2015.07.23 |
申请号 |
US201414553454 |
申请日期 |
2014.11.25 |
申请人 |
Sony Corporation |
发明人 |
Komachi Jun |
分类号 |
H01L29/786;H01L27/12;H01L29/66 |
主分类号 |
H01L29/786 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor device comprising:
a first region which is, in an oxide semiconductor layer, a region having a higher carrier concentration than a channel region immediately below a gate electrode formed over the oxide semiconductor layer and is formed at least in a partial region other than the channel region; and a second region which is, in the oxide semiconductor layer, a region having a higher carrier concentration than the first region and is formed farther from the channel region than the first region, wherein the first region is formed through a first reduction reaction by stacking a first reduction reaction film over the oxide semiconductor layer and reducing the oxide semiconductor layer by the first reduction reaction film, and wherein the second region is formed through a second reduction reaction by stacking a second reduction reaction film over the oxide semiconductor layer and reducing the oxide semiconductor layer by the second reduction reaction film. |
地址 |
Tokyo JP |