发明名称 SEMICONDUCTOR DEVICE, DISPLAY DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 There is provided a semiconductor device including a first region which, in an oxide semiconductor layer, has a higher carrier concentration than a channel region immediately below a gate electrode formed over the oxide semiconductor layer and is formed at least in a partial region other than the channel region, and a second region which, in the oxide semiconductor layer, has a higher carrier concentration than the first region and is formed farther from the channel region than the first region. The first region is formed through a first reduction reaction by stacking a first reduction reaction film over the oxide semiconductor layer and reducing the oxide semiconductor layer by the first reduction reaction film. The second region is formed through a second reduction reaction by stacking a second reduction reaction film over the oxide semiconductor layer and reducing the oxide semiconductor layer by the second reduction reaction film.
申请公布号 US2015206981(A1) 申请公布日期 2015.07.23
申请号 US201414553454 申请日期 2014.11.25
申请人 Sony Corporation 发明人 Komachi Jun
分类号 H01L29/786;H01L27/12;H01L29/66 主分类号 H01L29/786
代理机构 代理人
主权项 1. A semiconductor device comprising: a first region which is, in an oxide semiconductor layer, a region having a higher carrier concentration than a channel region immediately below a gate electrode formed over the oxide semiconductor layer and is formed at least in a partial region other than the channel region; and a second region which is, in the oxide semiconductor layer, a region having a higher carrier concentration than the first region and is formed farther from the channel region than the first region, wherein the first region is formed through a first reduction reaction by stacking a first reduction reaction film over the oxide semiconductor layer and reducing the oxide semiconductor layer by the first reduction reaction film, and wherein the second region is formed through a second reduction reaction by stacking a second reduction reaction film over the oxide semiconductor layer and reducing the oxide semiconductor layer by the second reduction reaction film.
地址 Tokyo JP